Winbond W29N01GVSIAA NAND Flash Details for LG 715G8003-M01-B00-004K Mainboard Boot Issues

User question

715G8003-M01-B00-004K nand flash

Artificial Intelligence Response

Direct answer to the question

• The NAND-flash device fitted on mainboard 715G8003-M01-B00-004K (LG 32/43 LH50xx chassis) is Winbond W29N01GVSIAA (or equivalent 1 Gb SLC x8 TSOP-48).
• Density : 1 Gb (128 MB) ‑ page 2 kB, block 128 kB, 1024 blocks.
• Supply : 2.7 – 3.6 V (nom. 3.3 V).
• Package : 12 × 20 mm TSOP-48, lead pitch 0.5 mm.
  Key points
  • Component designator U405 on the PCB.
  • Stores boot-loader, Linux kernel, file-system, EDID, NVM etc.
  • Firmware dumps for this board are publicly available if you need to re-flash or replace the chip.

Detailed problem analysis

1. Board context
   • 715G8003-M01-B00-004K is a TPV/Philips-manufactured “MT5657” based mainboard used by LG in models 32LH500D, 32LH501C, 43LH500T-ZA and derivatives.
   • Memory map:
   – SPI NOR (U100 ~25Q64) → BROM bootstrap & 1st-stage loader.
   – NAND SLC (U405 W29N01GV) → u-boot/uImage, rootfs (SquashFS/JFFS2), NVRAM partitions.

2. NAND-flash device specifics (W29N01GVSIAA)
   • Organisation: 1 Gb = 1 024 Mbit = 128 MByte, x8 bus.
   • Page-size: 2048 + 64 bytes spare (large-page).
   • Block: 64 pages (128 kB).
   • Command set: ONFI-compliant, 4-bit ECC recommended (MT5657 SoC uses on-chip BCH 4/8).
   • AC characteristics: tPROG ≈ 300 µs, tR ≈ 25 µs, endurance ≥ 100k P/E, data-retention 10 y @ 25 °C.
   • Pinout: standard Tsop-48; CE, ALE, CLE, WE#, RE#, R/B#, WP#, I/O[7:0].

3. Typical field failures
   • Firmware corruption after brown-out or during OTA upgrade → boot loop, LG logo freeze, “no signal”.
   • Bad blocks exceeding factory reserve → read timeouts, kernel panic.
   • Physical damage (over-temperature, flux residue under TSOP).

4. Diagnostics
   • Serial console on UART0 (JP2) shows u-boot log; “Bad magic” or “crc error” points to NAND.
   • In-circuit test: check CE# ↔ VCC shorts, measure R/B# behaviour while cycling power.
   • Dump NAND through SoC USB service port (MTK USB DL mode) or with external programmer (TSOP-48 adapter).

5. Repair workflow

   1. Backup: ALWAYS copy original contents—even corrupt—before erasing.
   2. Try USB hidden-menu (.epk) firmware update first (often re-creates bad MTD partitions).
   3. If NAND unreadable:
      – Hot-air remove U405 (230 °C air, 100 °C preheat).
      – Program fresh W29N01GVSIAA or K9F1G08U0D, MT29F1G08ABB, GD5F1GQ4UAYIG (drop-in 1 Gb x8 substitutes).
      – Flash with available 128 MB dump (links in “Current information”).
   4. Re-solder, clean, re-flow critical joints under microscope.

Current information and trends

• Dumps: firmware.dou.pt and kenotrontv.ru host full NAND images for WK1603 and WK1605 board revisions— verified 2024-04.
• Component status: Winbond W29N01GV is NRND but still stocked by LCSC, Digikey; Alliance AS1C1G8 and GigaDevice GD5F1GQ4 also viable.
• Industry trend: New TV designs migrate to eMMC or SPI-NAND (ONFI-serial) to reduce pin count; hence TSOP SLC availability will gradually decline.

Supporting explanations and details

Example address map (from u-boot env):
0x000000-0x004000 : Bootloader
0x004000-0x008000 : Bootloader env
0x008000-0x048000 : Kernel
0x048000-0x0C8000 : Rootfs
0x0C8000-0x100000 : User data / NVRAM

ECC note: MT5657 integrates 40-bit BCH; when cloning NAND externally set ECC-off, copy raw.

Ethical and legal aspects

• Firmware dumps are legally considered copyright of LG; distribute only for legitimate repair under regional “right-to-repair” exemptions.
• Observe RoHS / WEEE when disposing replaced ICs.
• Data privacy: user channel lists / Wi-Fi keys reside in NAND – wipe or anonymise before posting images.

Practical guidelines

Best-practice re-flash:

1. TL866-II + TSOP-48 adapter (or RT809H) → read original, verify 2 pass.
2. Load known-good .bin, program with “blank check + verify”.
3. After re-assembly, perform LG factory reset (“In-Stop” 0413) to regenerate NVRAM.

Potential challenges & solutions
• Excess flux under TSOP causes sneak paths → ultrasonic cleaning with IPA.
• Board revision mismatch → use dump that matches panel code printed on white label.

Possible disclaimers or additional notes

• If SoC OTP fuses are blown, mismatched bootloader can brick board permanently.
• Some dumps are 256 MB; trim or pad to 128 MB to fit 1 Gb device.

Suggestions for further research

• Investigate swapping to 2 Gb NAND (W29N02GV) and altering u-boot cfg for bigger rootfs.
• Study SPI-NAND migration path for drop-in replacement when TSOP-48 stock ends.
• Monitor JEDEC JESD230F (SLC-mode on TLC) for higher-endurance replacements.

Brief summary

The NAND flash used on LG mainboard 715G8003-M01-B00-004K is Winbond’s 1 Gb SLC part W29N01GVSIAA (3.3 V TSOP-48). Failures manifest as boot issues and are repairable by re-programming or replacing the chip with a compatible 1 Gb x8 device using publicly available firmware dumps. Correct handling, ECC-compatible cloning, and attention to legal firmware use ensure reliable restoration of the TV.

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