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Safe Removal of Kazama Tornado 348 Back Flap: Optimal Heating Time and Tools

131XIII 27315 10
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Treść została przetłumaczona polish » english Zobacz oryginalną wersję tematu
  • #1 16446816
    131XIII
    Level 11  
    Hello
    Wanting to be a bit more embraced on the phones, I decided to start Kazama Tornado 348 for educational purposes
    And this is a phone that has a double-sided tape on the back cover, I took a hair dryer and a guitar bow. I blew this dryer a bit for 2-3 minutes and the glue did not move. I blew a little more, but the aluminum frame was already very warm and I stopped heating because I was afraid that I would damage the motherboard. The phone works fine. And now the question is, how much more or less do I need to heat the phone to be able to remove this flap and not be afraid that something will happen to the motherboard under the influence of temperature.
    Do I need a hot air soldering iron to do it with peace of mind?
    And do I need anything more than a guitar bow?
    How do you deal with removing the back flap?
    Thanks in advance for your answers ;)
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  • #2 16446849
    micuszyn88
    Level 13  
    You need to heat up to about 90 degrees, best to do it with a heater, but a dryer will also do the trick :) it's best to start from the edge and gently pry it with something thin, for example with a guitar pick :) I did so. or something stiff but thin. When it starts to peel off, substitute something where it is already detached and continue to heat up. It is important not to rush and watch how the glue is released. I did it twice with the glass flap and it worked. I am sending greeting and I wish you good luck.
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  • #3 16446872
    131XIII
    Level 11  
    And heat it up for at least 5 minutes with a dryer? d
  • #4 16446884
    micuszyn88
    Level 13  
    Heat up and see from time to time if it starts to let go :) time is hard to tell :) I did it with a heater borrowed from a neighbor :) but I also watched if the glue was starting to release and I opened the flap, prying it open. :) If you only do flip removal tests, you have nothing to fear. If the operation is unnecessary, it is better to do it sensitively and carefully.
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  • #5 16446895
    gsmowiec
    User under supervision
    131XIII wrote:
    I stopped heating because I was afraid that I would damage the motherboard.


    Lead-free solder melts at about 230 degrees.
    If the dryer reached this temperature, it would burn your head ;)
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  • #6 16446942
    131XIII
    Level 11  
    Okay; d
    So I would have to try very hard to damage the motherboard with the temperature? ;)
  • #7 16446963
    micuszyn88
    Level 13  
    Sure. Just do not burn yourself when heating up because you need to heat up quite a bit.
  • #8 16450512
    blade1231
    Level 14  
    Glued phones with a battery inside, I do not recommend putting them on a heater. It is best to heat it up only at one point and not too much, and then with a scalpel (I use blades to remove the glue from under the polarizer), slightly lift the flap and insert the playing card into the slot. Once the card sits under the flap, we can easily cut the entire tape.

    In the new phones, everything is so folded that an ordinary wallpaper knife has a too thick blade, let alone a guitar pick.
  • #9 16451578
    jackq
    Level 12  
    I opened them all with a dryer. It's just that I put the phone in a container to limit the air blow to the sides and then I drift with a dryer to the maximum - it is much more efficient and faster than on the table. After about 1 minute, when it is very hot, I lift the backs with a plastic in the shape of a guitar feather.
  • #10 16452307
    blade1231
    Level 14  
    jackq wrote:
    I opened them all with a dryer. It's just that I put the phone in a container to limit the air blow to the sides and then I drift with a dryer to the maximum - it is much more efficient and faster than on the table. After about 1 minute, when it is very hot, I lift the backs with a plastic in the shape of a guitar feather.


    Did you do galaxy s6, s7 ??

Topic summary

The discussion centers on the safe removal of the back flap of the Kazama Tornado 348, which is secured with double-sided tape. Users recommend heating the device to approximately 90 degrees Celsius using a hair dryer or a heater for optimal results. It is advised to start heating from the edges and to use thin tools like a guitar pick or a playing card to gently pry the flap open. Caution is emphasized to avoid overheating, as temperatures above 230 degrees Celsius could damage internal components. Some users suggest using a scalpel for precision in cutting the adhesive. Overall, patience and careful monitoring of the glue's release are key to a successful removal.
Summary generated by the language model.
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