I'm laying out a rather dense, 4-layer PCB for a hobby project. The parts are a mix of SOT-23 and SOT-143 (basically a 4-pin SOT-23) transistors, with a sprinkling of 0603 resistors and capacitors. Most of the components have a connection to one of the two inner layers (GND and VDD). I'm only going to make one of these, and it will be assembled by hand.
To achieve the desired component density, I'm considering putting vias in the SMT pads. What are the issues with doing this?
None of the parts dissipates any significant heat, so I'm thinking I should use thermals to connect at the inner layers to make it easier to solder.
Is there anything else I should consider?
To achieve the desired component density, I'm considering putting vias in the SMT pads. What are the issues with doing this?
None of the parts dissipates any significant heat, so I'm thinking I should use thermals to connect at the inner layers to make it easier to solder.
Is there anything else I should consider?