Footprints for Pads

In making pads to a certain IC would you actually follow the IPC standards? What if the manufacturers have their own unique standards like different pitches?

I often make prototype boards with components that are hand placed and soldered so I make pads bigger for convenience. Also when I have parts that dissipate heat I make pads bigger or connect them to copper pour for heat dissipation. Through hole parts dissipate heat through their leads so heat can be less of a problem.

Like Stephen, I custom make pads for prototyping, to make them easier to hand solder. But, for production, I typically follow the manufacturer's specifications--which are designed to minimize stress on the part during reflow.

Not sure what you mean in the second part of your question. The pad needs to conform with the pitch of the leads on the part, or they won't line up.

So its most likely you do customize it considering its parameters and uses.

Its like when your just doing it for hobby it is preferable for a larger pad and if your doing it for commercial use its advisable to follow at least IPC standards.

It's also true that when you are using parts that generate heat like power mosfets a larger pad is desirable. You can even see reccommendations from manufacturers that power devices be connected directly to a large copper pad instead of with vias from the IPC pads. That only applies to parts that generate heat.

I also worked for a contract manufacturer who preferred larger pads on some small surface mount transistors so they got enough solder paste when a stencil was used, but that doesn't apply to prototyping.

Maybe you will like this site.
http://www.pcblibraries.com/
There is a program for design footprints.

But does it has sacrifice the the space for the PCB if you desire it to be just small like Arduino?

Tnx

The Library Expert also builds 3D STEP files alongside the libraries, if you get the 3D STEP module.