Following IPC Standards vs Manufacturer Specs for IC Pad Footprints and Pitch

When designing IC pad footprints, prototyping often involves customizing pad sizes larger than IPC standards to facilitate hand soldering and improve heat dissipation, especially for power devices like MOSFETs. For production, it is advisable to follow manufacturer specifications, which are optimized for reflow soldering and mechanical stress reduction. Pad pitch must always match the component lead pitch to ensure proper alignment. Manufacturers may recommend larger copper pads or direct connections for heat-generating components rather than relying solely on IPC standard pads. Contract manufacturers sometimes prefer larger pads on small surface-mount transistors to ensure adequate solder paste application with stencils. For hobbyist or compact designs, such as Arduino-sized PCBs, balancing pad size and board space is a consideration. Tools like PCB Libraries and the Library Expert software can assist in creating accurate footprints and 3D STEP models.
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