Experience with Mulpin embedded components for multi-layer PCB assembly and removal?

Ha anyone seen the new Mulpin method of embedding both passive and active components? They can be removed because of how they are embedded (through a hole in the PCB and can occupy multiple layers.

Yes but not in the real sence of the word in real world applications

I have read some articles with reference to mulpin, thinking that this may well be the solution to modern day smart card technology using the card itself as a semi multilayer card with embedded devices

Also a possible solution to counterfeit coins

On the comercial side Ive not seen this used as yet but know the difficulties with multilayer pcbs and servicing to component level both on the Industrial side and the telecoms industry which is concentrated area for the need to provide solutions for a non waste society and where the cost of servicing these products is a minumum of some 8k to 15k sterling with heavy investments into Infra red rework stations, hot air soltions and pre heat plates for removing such components

Im also fully aware of just how easy it is to damage multilayer bourds especially in todays applications with Rf embedded or encapsulated shielded components and concentrated ground planes within a multilayer enviroment

This is simply down to experiance


Yes looks interesting but I would want to see how these components can be easily removed as they claim they are, plus of course, the complexities surrounding fault diagnosis and the obvious most important questions surrounding cost both in the development side, hardware and software, and what this would in turn bring in terms of cost regarding training education and costs to Industry

But definately could be a solution to many challenges the Industry are facing at present

Thanks for Comments Mark. Mulpin ( for MULTi layer PIN) components have not been manufactured yet but removing them from a PCB is likely to be easier than removing an SMD component. The soldering process for instance could be done with very soft and low melting point solders, which exist but are not rigid enough to hold a conventional SMD part onto a PCB reliably. However each component can have (but not necessarily in all cases) a metal lid which is soldered with conventional lead free or lead solder. There are even components which need no solder at all. This is truly the start of a totally new way of thinking of embedded parts, Imagine for instance a circuit with several I/Cs buried so that their top surfaces just meet the top layer of the PCB (or just below). One single standard extruded heat sink with heat sink compound will transfer heat from the entire PCB. My imagination runs wild with what can be done and it is hard to keep up with the new patents. Cheers.