Yes but not in the real sence of the word in real world applications
I have read some articles with reference to mulpin, thinking that this may well be the solution to modern day smart card technology using the card itself as a semi multilayer card with embedded devices
Also a possible solution to counterfeit coins
On the comercial side Ive not seen this used as yet but know the difficulties with multilayer pcbs and servicing to component level both on the Industrial side and the telecoms industry which is concentrated area for the need to provide solutions for a non waste society and where the cost of servicing these products is a minumum of some 8k to 15k sterling with heavy investments into Infra red rework stations, hot air soltions and pre heat plates for removing such components
Im also fully aware of just how easy it is to damage multilayer bourds especially in todays applications with Rf embedded or encapsulated shielded components and concentrated ground planes within a multilayer enviroment
This is simply down to experiance
Yes looks interesting but I would want to see how these components can be easily removed as they claim they are, plus of course, the complexities surrounding fault diagnosis and the obvious most important questions surrounding cost both in the development side, hardware and software, and what this would in turn bring in terms of cost regarding training education and costs to Industry
But definately could be a solution to many challenges the Industry are facing at present
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