I'm a student working for a micropackaging company. We do lots of wirebonding and die attach. My boss told me to test a MEM to make sure it works after we bond and package it. I'm very aware of how little I know on this topic. Can someone explain how to test this if it's in a DIP.
Paul, the MEMs devices are subjected to a variety of electrical tests to determine if they function properly. Wafer testing usually with probes on a probe card Minimal test to see if the device has been manufactured and to weed device that are rejects prior to assembly (wire bonding and die bonding) and then after packaging prior to shipment to the customer. Once the MEMS device is in a package then a test socket with connections to electrical test equipment for exercise the prat through a electrical data sheet.
there are two basic types of test for electrical devices and of course another for a MEMS device. 1-DC electrical includes input current, output current or logical levels, power supply current.
2-AC Testing any AC testing, pulse testing, and testing for unique parameters such as "Testing for open loop at resonant frequency (peak gain at resonant frequency"
3-MEMs functionality what ever the device does mechanically , ink jet , pressure sensor, etc here's a couple of youth video's I am sure you can find more
