Copper Foil Conductive Adhesive: Lower vs Higher Electrical Resistance for EMI Shielding

282 1

ADVERTISEMENT

Report a violation of the law

Reply | New topic

#1 21673314 03 Feb 2015 10:43

michelle coslet michelle coslet

Anonymous

Post #1
21673314 03 Feb 2015 10:43

I am sourcing a Copper Foil Conductive Adhesive and I was curious which is better for grounding and EMI shielding, Lower Electrical resistance (.003 Ohms/in2) or higher Electrical resistance (.005 Ohms/in2).

Thank you in advance
ADVERTISEMENT
#2 21673315 03 Feb 2015 19:21

Emmanuel Galleto Emmanuel Galleto

Anonymous

Post #2
21673315 03 Feb 2015 19:21

Hi michelle,

I can only contribute pdfs of Grounding and EMI shielding.

1. Grounding & Shielding
2. Engineering Aspects of Electromagnetic Shielding

Hope it helps,
Create an account, log in here. You will receive points by participating in discussions.
Join this discussion.

Install Elektroda application

Didn't find an answer? Ask Artificial Intelligence

*I agree to send the question to OpenAI, Anthropic PBC, Perplexity AI, Inc., Kagi Inc., Google LLC - owners of language models in order to prepare the best response. The companies may monitor and log information entered into the form.

*I agree to publicly display my question and answer. The question and answer will be publicly available to everyone. The process may take a few minutes. Upon completion, you will be redirected to the page with the answer.

Wait...(2min)

Reply | New topic

Report a violation of the law

ADVERTISEMENT