Hey there,
I recently started designing RF PCB's and as a beginner, I stuck to the traditional 4 layers stack up for the RF boards (1-RF layer, 2-GND, 3-VCC, 4-Signal). But I am curious to know whether it is possible to design RF PCB's without compromising its performance with 2 layers. This would not only reduce the cost of my PCB production and also makes it easy to design. I am planning to make this RF board for a BLE application with ESP32-PICO-D4(50ohms impedance) as the MCU and Johanson's 2450at18a100e antenna(50ohms impedance). So, is it possible to design the transmission line between the MCU and antenna for 50ohms impedance on a 2 layer stack-up? If yes, how can I do that?
Operating frequency - 2.4GHz
Voltage - 3.3V
Thanks in advance
I recently started designing RF PCB's and as a beginner, I stuck to the traditional 4 layers stack up for the RF boards (1-RF layer, 2-GND, 3-VCC, 4-Signal). But I am curious to know whether it is possible to design RF PCB's without compromising its performance with 2 layers. This would not only reduce the cost of my PCB production and also makes it easy to design. I am planning to make this RF board for a BLE application with ESP32-PICO-D4(50ohms impedance) as the MCU and Johanson's 2450at18a100e antenna(50ohms impedance). So, is it possible to design the transmission line between the MCU and antenna for 50ohms impedance on a 2 layer stack-up? If yes, how can I do that?
Operating frequency - 2.4GHz
Voltage - 3.3V
Thanks in advance
